MSV500 – High-precision laser micromachining for series production
The MSV500 from msolv is a powerful production platform for high-precision Laser micromachining of large-area substrates and panels. The dual-XY system combines high positioning accuracy with fast throughput and can be scaled from research and process development to industrial series production.
With a supported substrate area of up to 610 × 510 mm and a positioning accuracy of up to ±8 µm the MSV500 is particularly well-suited for complex structures on modern IC substrates and other demanding electronic components.
Flexible laser and optics configuration
The MSV500 can be used with various IR lasers, UV nanosecond lasers, or fiber lasers be equipped. Two large optical breadboards provide sufficient space for lasers, beam guidance, and application-specific optics.
This allows several process heads and different laser technologies to be combined within a common system platform. This enables targeted adaptation of the system to different materials and processing operations.
Precise Via Drilling for IC Substrates
For applications on modern IC substrates, the MSV500 can be used, for example, with a 532 nm picosecond laser be equipped. This allows vias with diameters up to 15 µm produced in a largely cold working process.
The use of ultrashort pulse lasers minimizes heat-affected zones and unwanted damage to the substrate, which is particularly crucial for fine structures and sensitive materials.
VERSA SPOT® – different structures without changing the optics
A special feature of the MSV500 is the proprietary VERSA SPOT® technology from msolv. It enables you to quickly switch between different via sizes and the editing of larger cavities for embedded components within a single editing program.
Changing the optics or other hardware is not required for this. As a result, different processing steps can be automated within a common process.
High throughput for complex panels
According to msolv, the MSV500 achieves a throughput of up to 8,000 routes per second. The platform was also designed for applications with 8 to 10 million vias per panel Tested.
For a further increase in throughput, the system can be four high-speed scanners be configured and process two panels in parallel. This explicitly makes the system designed for high production volumes.
Automation and Process Control
The MSV500 is powered via the ISC software from msolv controlled. Path optimization algorithms and OPTI-SCRIBE™ technology support efficient process planning and short processing times.
Machine-vision cameras enable automatic component alignment and inspection. The system can also compensate for thermal shrinkage, deformation, and deflection of the workpiece and dynamically correct the focus during processing. Interfaces for automatic loading and unloading systems enable integration into production lines.
Typical applications
- Via Drilling for IC Substrates
- Advanced Packaging
- Laser micromachining of large-area panels
- Manufacturing of cavities for embedded components
- Structuring of complex electronic substrates
- High-volume laser processing
- Research, pilot production, and series production
- Automated production lines
MSV500 from msolv
The MSV500 connects high positioning accuracy, flexible laser configurations, and high throughput in a scalable production platform. With technologies like VERSA SPOT®, automatic workpiece correction and multi-scanner configurations, the system can be specifically adapted to complex micromachining processes.
Soliton assists you in configuring the MSV500 and selecting suitable lasers, optics, and process parameters for your application.
