MSV-300 Scanned Mask Imaging

  • Capacitive touch panels
  • battery technologies
  • Flexible thin glass
  • Transparent conductive coatings
  • additional laser drilling
  • Large area electronics
  • IC substrates

Contact person: Wolf Wagner (Ph.D.)

High-precision laser material processing with MSV-300 Scanned Mask Imaging

The MSV-300 Scanned Mask Imaging System is a powerful solution for precise laser material processing. It combines high processing speed with excellent imaging quality and is suitable for a wide range of industrial applications. Thanks to the special scanned mask technology, mask patterns are transferred to the workpiece with high accuracy, enabling complex structures to be created in minimal processing time.

Technical properties

The system uses a powerful laser in combination with a fast scanning module. This allows mask images to be created with high repeat accuracy and fine resolution. The MSV-300 platform supports different laser sources so that it can be flexibly adapted to different materials and processing tasks.

Advantages of the MSV-300 system

The scanned mask technology enables uniform and distortion-free imaging over large areas. This achieves both high precision and high production speed. The system is compact, low-maintenance and can be easily integrated into existing production processes.

Areas of application

The MSV-300 system is used in micro material processing, electronics production, the manufacture of microstructures and in medical technology. Typical applications include cutting, structuring, drilling and marking of sensitive materials.

Contact and advice

For further technical information and a solution tailored to your application, we will be happy to provide you with an individual offer. Visit our product page. Further technical information on laser material processing can be found at SPIE - The International Society for Optics and Photonics.

Specifications

  • Flexible system platform with lasers, traversing tables, scanners or print heads
  • Combination of laser processes with inkjet processes
  • The choice of laser depends on the respective ablation process
  • Sample production for process optimization
  • Substrate handling manual or automated

Applications

  • Laser micromachining
  • Flex cutting
  • Laser thin film ablation
  • Editing of IC substrates, with via drilling
  • touch panels
  • Flexible displays
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