MSV100 – Flexible laser processing for research and process development
The MSV100 by msolv is a high-precision laser processing system for Research and development, process development, and small-batch production. The compact and modular platform can be equipped with various lasers, optical systems, and process components, allowing it to be specifically tailored to the respective application.
With a XY work area of 300 × 300 mm enables the precise processing of substrates and wafers up to 12″. Despite its comparatively small footprint, the system thus offers sufficient workspace for numerous applications in microelectronics, photovoltaics, and material processing.
Modular design for different laser processes
The MSV100 is for small to medium-sized lasers as well as complex beam shaping and beam delivery optics designed. Depending on the process, the platform can be equipped with up to two fast galvanometer scanners as well as additional components such as power meters, sensors, or customer-specific workpiece holders. Safe extraction of process residues is also provided.
This makes the system suitable both for developing new laser processes and for transferring them into smaller production environments.
Precise positioning and easy setup
An integrated Machine Vision System supports the alignment of scanner, optics, and workpiece. The focusing optics are located on a controlled vertical axis, while the integrated software supports the setup and execution of research and production tasks.
For high mechanical and thermal stability, the MSV100 is based on stable granite platforms with vibration isolators and steel frames. This effectively dampens external vibrations and supports reproducible machining conditions.
Diverse processes and materials
The MSV100 can be used for various laser processes such as Scribing, drilling, cutting, structuring, depaneling, and dicing can be configured. Msolv mentions, among other things, IC substrates, complex printed circuit boards, thin-film photovoltaics, and transparent conductive oxides such as ITO as typical application areas. The structuring of crystalline solar cells is also part of the range of applications.
Typical applications
- Laser process development and research
- Microelectronics and IC substrates
- PCB Processing and Depaneling
- Thin-film photovoltaics
- Structuring of transparent conductive layers
- Wafer Dicing
- Drilling and cutting
- Laser Scribing and Patterning
MSV100 by msolv
Through his compact and modular design the MSV100 offers an interesting entry into professional laser process development without having to sacrifice the configuration options of larger systems. Laser source, beam guidance, scanner, sensor technology, and workpiece holder can be put together according to the respective application.
Soliton supports you in selecting and configuring the MSV100 for your specific laser processing task.
