{"id":12543,"date":"2026-09-09T14:24:31","date_gmt":"2026-09-09T12:24:31","guid":{"rendered":"https:\/\/soliton-gmbh.de\/?post_type=product&p=12543"},"modified":"2026-09-09T14:35:46","modified_gmt":"2026-09-09T12:35:46","slug":"msv500-production-system-for-high-precision-laser-micromachining","status":"publish","type":"product","link":"https:\/\/soliton-gmbh.de\/en\/produkt\/msv500-produktionssystem-fuer-hochpraezise-lasermikrobearbeitung\/","title":{"rendered":"MSV500 \u2013 Production system for high-precision laser micromachining"},"content":{"rendered":"

MSV500 \u2013 High-precision laser micromachining for series production<\/h2>\n

The MSV500 from msolv<\/strong> is a powerful production platform for high-precision Laser micromachining of large-area substrates and panels<\/strong>. The dual-XY system combines high positioning accuracy with fast throughput and can be scaled from research and process development to industrial series production.<\/p>\n

With a supported substrate area of up to 610 \u00d7 510 mm<\/strong> and a positioning accuracy of up to \u00b18 \u00b5m<\/strong> the MSV500 is particularly well-suited for complex structures on modern IC substrates and other demanding electronic components.<\/p>\n

Flexible laser and optics configuration<\/h2>\n

The MSV500 can be used with various IR lasers, UV nanosecond lasers, or fiber lasers<\/strong> be equipped. Two large optical breadboards provide sufficient space for lasers, beam guidance, and application-specific optics.<\/p>\n

This allows several process heads and different laser technologies to be combined within a common system platform. This enables targeted adaptation of the system to different materials and processing operations.<\/p>\n

Precise Via Drilling for IC Substrates<\/h2>\n

For applications on modern IC substrates, the MSV500 can be used, for example, with a 532 nm picosecond laser<\/strong> be equipped. This allows vias with diameters up to 15 \u00b5m<\/strong> produced in a largely cold working process.<\/p>\n

The use of ultrashort pulse lasers minimizes heat-affected zones and unwanted damage to the substrate, which is particularly crucial for fine structures and sensitive materials.<\/p>\n

VERSA SPOT\u00ae \u2013 different structures without changing the optics<\/h2>\n

A special feature of the MSV500 is the proprietary VERSA SPOT\u00ae technology from msolv<\/strong>. It enables you to quickly switch between different via sizes and the editing of larger cavities for embedded components within a single editing program.<\/p>\n

Changing the optics or other hardware is not required for this. As a result, different processing steps can be automated within a common process.<\/p>\n

High throughput for complex panels<\/h2>\n

According to msolv, the MSV500 achieves a throughput of up to 8,000 routes per second<\/strong>. The platform was also designed for applications with 8 to 10 million vias per panel<\/strong> Tested.<\/p>\n

For a further increase in throughput, the system can be four high-speed scanners<\/strong> be configured and process two panels in parallel. This explicitly makes the system designed for high production volumes.<\/p>\n

Automation and Process Control<\/h2>\n

The MSV500 is powered via the ISC software from msolv<\/strong> controlled. Path optimization algorithms and OPTI-SCRIBE\u2122 technology support efficient process planning and short processing times.<\/p>\n

Machine-vision cameras enable automatic component alignment and inspection. The system can also compensate for thermal shrinkage, deformation, and deflection of the workpiece<\/strong> and dynamically correct the focus during processing. Interfaces for automatic loading and unloading systems enable integration into production lines.<\/p>\n

Typical applications<\/h2>\n